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MR133

SLAM/VSLAM智能掃地機高性能解決方案

産品

芯片框圖

MR133

基本規格

CPU

• Quad-core ARM CortexTM-A7@1.8GHz
• 32KB L1 I-cache + 32KB L1 D-cache per core
• 512KB L2 cache
• Low-power CoolFlex™ power management architecture

GPU

• Mali400 MP2
• Supports OpenGL ES 2.0/1.1, Direct3D 11.1, OpenVG 1.1

Memory

• Supports 32-bit DDR4/DDR3/DDR3L/LPDDR3/LPDDR4
• Supports eMMC 5.0, compatible with eMMC 5.1, support Full Disk Encryption(FDE)
• Supports 8-bit TLC/MLC/SLC/EF NAND flash, supports FDE
• Supports LDPC/80-bit BCH/1024bytes

Video Engine

• Supports H264 HP encoder 1080P@60fps
• Supports 3-bit rate control: CBR, VBR, FIXQP
• Supports JPEG encoder 4096 x 4096

Video Input

• Compliant with MIPI-CSI2 V1.00 and MIPI DPHY V1.00.00
• 1/2/3/4 Data Lanes Configuration and up to 1Gbps per Lane in HS Transmission
• Maximum to 13M@15fps, or 8M@30fps with 4 data lane
• Supports format: YUV422-8bit/10bit, YUV420-8bit, RAW-8, RAW-10, RAW-12, RGB888, RGB565

ISP

• Maximum picture resolution of 4224x3168
• Adjustable 3A functions, including automatic exposure(AE), automatic white balance(AWB) and automatic focus (AF)
• Supports spatial(2D) de-noise filter
• Supports contrast enhance and sharping
• Supports chrominance noise reduction
• Supports defect pixel correction

Memory

• Supports two audio DAC and one audio ADC
• Supports Three analog audio inputs and one analog audio outputs
• Capless stereo headphone driver
• Up to two I2S/PCM controllers for connecting Bluetooth and external audio codec
• Integrated digital microphone, supports maximum 8 digital microphones

Security Engine

• Supports Symmetrical algorithm: AES,DES,3DES,XTS
• Supports Hash algorithm: MD5,SHA,HMAC
• Supports Pubic Key algorithm: RSA, ECC
• Supports 160-bit hardware PRNG with 175-bit seed
• Supports 256-bit hardware TRNG
• Supports 2.5K-bit EFUSE for chip ID and security application

Connectivity

• USB Host, USB 2.0 OTG
• SDIO 3.0, RSB
• 4 x TWI, 2 x SPI
• 6 x UART, 3 x PWM
• GPADC, KEYADC

WIFI

• XR829 or others

OS

• Tina、Android 8.1 or above

PMIC

• PMU AXP2585
• BMU AXP15060

Package

• FBGA 413balls
• 12.3mm x 12.8mm size,0.5 ball pitch,0.3 ball size

Process

• 28nm HPC

方案亮點

高性能與高能效的雙重提升
高性能與高能效的雙重提升
13MP Camera +ISP 配置
13MP Camera +ISP 配置
強大的多媒體支持
強大的多媒體支持
接口豐富 2路USB2.0、2路SPI、4路TWI、6路UART、3路PWM、KEYADC, GPADC, SDIO3.0, etc.
接口豐富 2路USB2.0、2路SPI、4路TWI、6路UART、3路PWM、KEYADC, GPADC, SDIO3.0, etc.

典型機型

MR133

相關新聞

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